MIT Manipal B Tech Placement 2026 : The Manipal Institute of Technology (MIT), Manipal Academy of Higher Education (MAHE) Manipal released the placement for the B Tech batch . The highest salary offered is Rs. 55.22 LPA. B Tech placement data from MIT Manipal, widely shared and analyzed by the student community and placement team representatives, here is the comprehensive branch-wise breakdown for the 2026 graduating batch.
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Key Takeaways & Trends
- Computing Branches Dominate CTC: Computer Science (B Tech CSE), Information Technology (IT), and Computer & Communication (CCE) maintained dominant average packages ranging between 13.4 LPA and 14.6 LPA, while securing the peak highest CTC of 55.22 LPA.
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- High Conversion in Core Branches: Interestingly, branches with lower student registries—such as Civil (88.89%) and Aeronautical (86.67%)—recorded exceptionally high placement percentages, though their median CTCs remain lower compared to circuital and software fields.
- The Higher Education Factor: A significant portion of unplaced students, particularly across core engineering branches, voluntarily opt out of campus placements to pursue Master’s programs (M.Tech/MS) or MBA degrees in India and abroad. This choice significantly impacts the absolute “Placed %” shown on paper.
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Branch-Wise Placement Data 2026:
| Branch | Placement % | Average CTC (LPA) | Median CTC (LPA) | Highest CTC (LPA) |
| Civil Engineering (CV) | 88.89% | 6.11 | 6.00 | 7.03 |
| Aeronautical Engineering (AE) | 86.67% | 7.94 | 5.00 | 14.50 |
| Information Technology (IT) | 82.96% | 13.47 | 12.00 | 55.22 |
| Electronics & Instrumentation (E&I) | 82.86% | 8.72 | 7.60 | 14.50 |
| Cyber Physical Systems (CPS) | 80.00% | 9.05 | 7.60 | 18.75 |
| Computer & Communication (CCE) | 78.33% | 13.80 | 12.00 | 55.22 |
| Industrial Engineering (IE) | 75.00% | 11.66 | 7.60 | 21.37 |
| Computer Science & Engineering (CSE) | 72.31% | 14.61 | 13.05 | 55.22 |
| CSE AI & ML | 70.59% | 11.91 | 8.76 | 44.59 |
| Mechatronics (MT) | 70.18% | 8.68 | 9.56 | 21.37 |
| Mechanical Engineering (ME) | 69.81% | 10.34 | 9.56 | 18.50 |
| Electrical & Electronics (EEE) | 69.23% | 9.08 | 8.00 | 24.78 |
| Automobile Engineering (AU) | 66.67% | 9.62 | 10.50 | 10.50 |
| Data Science (DS) | 63.64% | 12.03 | 10.90 | 26.02 |
| Electronics & Communication (ECE) | 61.36% | 11.86 | 7.60 | 31.75 |
| Biotechnology (BT) | 50.00% | 7.50 | 7.50 | 9.00 |
| Chemical Engineering (CH) | 42.86% | 8.37 | 7.50 | 14.00 |
| Biomedical Engineering (BM) | 22.22% | 6.05 | 6.05 | 8.50 |
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Premium Recruiters & Hiring Patterns
The 2026 campus recruitment drive saw elite Pre-Placement Offers (PPOs) and on-campus slots distributed across top-tier tech giants, semiconductor firms, and consulting institutions:
- Microsoft (55.22 LPA): Selected 6 students via PPOs (3 from CSE, 2 from CCE, and 1 from IT).
- LinkedIn & Uber (44.59 LPA / 41.00 LPA): Both tech companies recruited 1 student each, specifically targeting the CSE AI & ML branch.
- Analog Devices (31.75 LPA) & NXP Semiconductors (23.64 LPA): These top-tier core hardware/silicon design firms targeted ECE students exclusively.
- Goldman Sachs & D.E. Shaw (30.00 LPA): Showed a strong preference for computing profiles, pulling talent primarily from CCE and CSE.
- SAP Labs (26.02 LPA): Cast a wider net across circuit and data domains, onboarding 18 students across IT, CCE, CSE, Data Science, and ECE.
- Flipkart (14.50 LPA): Acted as a highly versatile recruiter across diverse engineering verticals, hiring 12 students across Aeronautical, Cyber Physical Systems, ECE, E&I, and Mechanical Engineering.
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